Pattern forming apparatus, mark detecting apparatus, exposure apparatus, pattern forming method, exposure method, and device manufacturing method
AssigneeNikon Corporation
InventorYuichi Shibazaki
Life of this patent
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AssigneeNikon Corporation
InventorYuichi Shibazaki
Estimating the term…
While a wafer stage linearly moves in a Y-axis direction, a multipoint AF system detects surface position information of the wafer surface at a plurality of detection points that are set at a predetermined distance in an X-axis direction and also a plurality of alignment systems that are arrayed in a line along the X-axis direction detect each of marks at positions different from one another on the wafer. That is, detection of surface position information of the wafer surface at a plurality of detection points and detection of the marks at positions different from one another on the wafer are finished, only by the wafer stage (wafer) linearly passing through the array of the plurality of detection points of the multipoint AF system and the plurality of alignment systems, and therefore, the throughput can be improved.
An exposure apparatus that exposes an object with an energy beam, the apparatus comprising:
An exposure apparatus that exposes an object with an energy beam, the apparatus comprising:
A mark detecting apparatus that detects marks on an object, the apparatus comprising:
Dependencies are inferred from the claim text.