Substrate features for mitigating stress

An article comprising:

• a substrate;
• a plurality of cooling holes formed in the substrate;
• a first array of features on a surface of the substrate at a first location, wherein the first array comprises a first pattern comprising a grid of grooves, wherein each of the grooves does not extend through the substrate, wherein the grid of grooves comprises a first plurality of grooves formed substantially parallel to each other and a second plurality of grooves formed substantially parallel to each other, wherein the grooves from the first plurality of grooves intersect grooves from the second plurality of grooves, wherein the grid of grooves defines a plurality of plateaus in the substrate, and wherein a respective cooling hole of the plurality of cooling holes is formed in a respective plateau of the plurality of plateaus;
• a second array of features on the surface of the substrate at a second location, wherein the second array comprises a second pattern different than the first pattern, wherein the first location is predicted to experience a first level of thermal stress and the second location is predicted to experience a second level of thermal stress different than the first level of thermal stress;
• and
• a thermal barrier coating on the substrate, on the first array of features, including on the grid of grooves and the plurality of plateaus, and on the second array of features.

A method comprising:

• forming a first array of features on a surface of a substrate at a first location, wherein the first location is selected based on a first predicted level of thermal stress, wherein the first array of features comprises a first pattern comprising a grid of grooves, wherein each of the grooves does not extend through the substrate, wherein the grid of grooves comprises a first plurality of grooves formed substantially parallel to each other and a second plurality of grooves formed substantially parallel to each other, wherein the grooves from the first plurality of grooves intersect grooves from the second plurality of grooves, wherein the grid of grooves defines a plurality of plateaus in the substrate, and wherein a respective cooling hole of a plurality of cooling holes is formed in a respective plateau of the plurality of plateaus;
• forming a second array of features on the surface of the substrate at a second location, wherein the second location is selected based on a second predicted level of thermal stress, and wherein the second array of features comprises a second pattern different than the first pattern;
• and
• forming a thermal barrier coating over the substrate, over the first array of features, including on the grid of grooves and the plurality of plateaus, and over the second array of features.