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US 8,852,689 B2Granted
Surfaces having particles and related methods
AssigneeInnova Dynamics, Inc.
InventorsArjun Daniel Srinivas, Calvin Peng, Alexander Chow Mittal, Priyanka Agarwal
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Abstract
Particles are embedded in a substrate by applying to at least a portion of the substrate a fluid and a population of particles, such that the substrate is softened to at least a degree that particles are at least partially embedded in the softened portion of the substrate. The softened portion of the substrate is hardened so as to securely embed the particles in the substrate.
Claims16
A method of embedding particles in a substrate, comprising:
- applying to at least a portion of a substrate a fluid and a population of particles comprising metallic nanowires, such that the substrate is softened to at least a degree that a plurality of individual particles is at least partially embedded in the softened portion of the substrate;
- and
- hardening the softened portion of the substrate so as to securely embed the plurality of particles in the substrate,
- wherein the plurality of particles securely embedded in the substrate forms a conductive pathway by touching or proximity of the particles to one another.
1 more element
A method of embedding particles in a substrate, comprising:
- providing a substrate;
- providing a population of particles selected from at least one of nanowires, nanorods, and nanotubes;
- and
- using a fluid, softening the substrate such that one or more of the population of particles is at least partially embedded in the substrate,
- wherein at least one individual particle of the population of particles is fully embedded below a surface of the substrate,
- wherein multiple ones of the population of particles are embedded in the substrate to form a conductive pathway by touching or proximity of the particles to one another.
3 more elements
Dependencies are inferred from the claim text.