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US 8,839,519 B2Granted
Method of making cold chassis for electronic modules
AssigneeRaytheon Company
InventorsDavid H. Altman, Scott R. Cheyne, Anurag Gupta
Life of this patent
Estimating the term…
Abstract
A scalable method of edge cooling and making a cold chassis for electronic modules. The steps include fabrication of modular cooling ribs, each including microchannels along the cooling edge and a peripheral flange. A set of adjacent ribs are secured together and assembled onto at least one face of a chassis frame member. The rib flanges are sealed (e.g. friction stir welded) with respect to the frame member. The Application includes new and retrofit environments with increased cooling needs and multi-scaled manufacturing.
Claims20
A method comprising:
- fabricating individual brazed cooling ribs, each of the ribs having a lengthy member including microchannels along the lengthy member thereof and a peripheral flange;
- securing a plurality of adjacent ribs together;
- assembling the plurality of secured ribs onto at least one face of a frame member of a cold chassis configured to edge cool one or more electronic modules;
- and
- sealing the peripheral flanges of the ribs with respect to the frame member.
2 more elements
A method comprising:
- fabricating individual ribs to provide cooling, each of the ribs including a peripheral flange;
- manufacturing a frame member of a cold chassis configured to edge cool one or more electronic modules to include on at least one face thereof patterned adjacent recesses for the ribs;
- placing one rib in each recess in the frame member;
- and
- sealing the peripheral flange of each rib in the associated recess.
2 more elements
Dependencies are inferred from the claim text.