Methods of fabricating an array capacitor
AssigneeIntel Corporation
InventorSriram Dattaguru
Life of this patent
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Abstract
Methods of fabricating an array capacitor are disclosed, in which via structures of the array capacitor have increased uniformity in their transverse areas. One method involves perforating a capacitor body to form first holes extending from a first surface and partially through the capacitor body. The capacitor body may be further perforated to form second holes extending from a second opposed surface of the capacitor body. The second holes are to connect to the first holes to provide through holes extending across a thickness of the capacitor body. An appropriate conductive material may then be filled in the through holes to form via structures with increased uniformity in their transverse areas.
Claims7
A method of fabricating an array capacitor, comprising:
- providing a capacitor body having an interleaved arrangement formed of a plurality of dielectric layers and electrode layers, the capacitor body having a first main surface and an opposed second main surface;
- perforating the capacitor body to form a plurality of through holes connecting the first and the second main surfaces of the capacitor body;
- removing a portion of the capacitor body to increase uniformity of a transverse area at each of the through holes, wherein prior to removing a portion of the capacitor body, ascertaining at least a reference point at a first end of each of the through holes and using the reference point to determine the portion of the capacitor body to be removed proximate to a second end of each of the through holes, and wherein the first end having a larger transverse area than the second end;
- and
- providing an electrically conductive material in the through holes.
A method of fabricating an array capacitor, comprising:
- providing a capacitor body having an interleaved arrangement formed of a plurality of dielectric layers and electrode layers, the capacitor body having a first main surface and an opposed second main surface;
- perforating the capacitor body to form a plurality of through holes connecting the first and the second main surfaces of the capacitor body;
- ascertaining at least a reference point at a first end of each of the through holes and using the reference point to determine the portion of the capacitor body to be removed proximate to a second end of each of the through holes, wherein the first end having a larger transverse area than the second end;
- removing a portion of the capacitor body to increase uniformity of a transverse area at each of the through holes;
- providing an electrically conductive material in the through holes;
- and
- embedding the capacitor body in a package substrate to dispose the capacitor body in proximity with a semiconductor die.
Dependencies are inferred from the claim text.