Implementing conductive microcapsule rupture to generate a tamper event for data theft prevention

#The present invention relates generally to the data processing field, and more particularly, relates to a method and circuit for implementing conductive microcapsule rupture to generate a tamper event for data theft prevention, and a design structure on which the subject circuit resides.

#Current security devices, such as IBM's X-crypto, are implemented to protect against data theft in both high end and personal computing systems. These devices utilize a tamper sensor device or special high-priced security tamper mesh that senses tampering events through pressure and/or cuts.

#Often it is important that such security devices meet the highest level requirements for security protection contained in the U.S. Government Federal Information Processing Standard (FIPS) 140-2 Security Requirements for Cryptographic Modules—(Level 4). The standard states that: “At this security level, the physical security mechanisms provide a complete envelope of protection around the cryptographic module with the intent of detecting and responding to all unauthorized attempts at physical access” (FIPS Pub 140-2).

#The present invention together with the above and other objects and advantages may best be understood from the following detailed description of the preferred embodiments of the invention illustrated in the drawings, wherein:

#FIG. 1 is a flow chart illustrating exemplary steps for implementing a microcapsule and circuits for implementing data theft prevention in accordance with the preferred embodiment;

#FIG. 2 is a flow chart schematically illustrating an example process for manufacturing the microcapsules of FIG. 1 in accordance with the preferred embodiment;

#In the following detailed description of embodiments of the invention, reference is made to the accompanying drawings, which illustrate example embodiments by which the invention may be practiced. It is to be understood that other embodiments may be utilized and structural changes may be made without departing from the scope of the invention.

#The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the singular forms “a”, “an” and “the” are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms “comprises” and/or “comprising,” when used in this specification, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof.

#In accordance with features of the invention, a method and circuit for implementing data theft prevention, and a design structure on which the subject circuit resides are provided. The circuit includes microcapsules containing a conductive material provided within a polymeric resin. The polymeric resin is used to encapsulate a security card and a tamper sensor device provided with the security card. The tamper sensor device includes a currently known tamper sensor device, such as a tracer tamper mat or other tamper event sensors to detect resistance changes. Polymeric resin can be UV or heat cured to increase processability. When sufficient force is applied to the polymeric resin one or more microcapsules rupture, the conductive material of ruptured microcapsules creates resistance changes, for example by dispersing the conductive material between a tamper mesh of the tamper sensor device thus lowering the resistance in the tamper sensor device. The tamper sensor device then renders the card unusable. The microcapsules are more sensitive to pressure than the tamper sensor device and therefore rupture easier to create a change in resistance in the tamper sensor device when the conductive material of ruptured microcapsules disperses onto the tamper sensor device.