Application of a processing pin to a gemstone which is to be cut or polished

A method of applying a next pin as a follow-on pin to a stone wherein the stone is held by a preceding pin fixed to the stone by way of a first adhesive bonding location, wherein the preceding pin (10) is to be separated from the stone to hold it with the next pin as the follow-on pin (20, 30), the follow-on pin is fixed to the stone by way of a second adhesive bonding location (21, 31) spaced from the first adhesive bonding location;

• wherein
• the stone is held by the preceding pin at least during an application of the follow-on pin;
• the follow-on pin receives a fluid adhesive at a front end thereof and when still being at a distance from the stone and a space between the fluid adhesive carrying front end and the stone is reduced until the fluid adhesive contacts the stone;
• the fluid adhesive is hardened at the contact location to build the second adhesive bonding location;
• heat is transmitted to the first adhesive bonding location through the preceding pin, by introducing the heat into the preceding pin at a distance from the first adhesive bonding location to soften or weaken the first adhesive bonding location;
• a mechanical force component as a transverse force is applied to the preceding pin to release and separate the preceding pin from the stone and holding the stone with the next pin as the follow-on pin at the second adhesive bonding location;
• and
• the stone (3) with next and preceding pins thereon is moved and the preceding pin as free-standing pin (10) is moved against and contacts an edge or a leg, while the stone is being held clamped in a chuck (76) at the next pin as follow-on pin.