Inclusion of chip elements in a sheathed wire
AssigneeCommissariat A L'energie Atomique Et Aux Energies Alternatives
InventorsJean Brun, Laurent Lancon, Dominique Vicard
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Abstract
A method for forming a sheathed wire includes the steps of: axially advancing a core through a sheathing zone; wrapping a sheathing fiber around the core in the sheathing zone; and providing, in the sheathing zone, a series of microelectronic chip elements each provided with a wire section, in such a way that the sheathing fiber that wraps around the core also wraps around a chip element and the wire section thereof to form a sheathed wire incorporating spaced-apart chip elements.
Claims9
A method for forming a sheathed wire, comprising the following steps of:
- axially advancing a core through a sheathing zone;
- providing, in the sheathing zone, a series of microelectronic chip elements and at least one wire section connected to each chip element from an insertion device;
- and,
- wrapping a sheathing fiber around the core in the sheathing zone, around the microelectronic chip elements, and around the wire sections concurrently with the step of providing the microelectronic chip elements and the wire sections in the sheathing zone from the insertion device to form the sheathed wire such that the microelectronic chip elements are spaced-apart from each other.
A sheathed wire comprising:
- a core;
- a sheathing fiber wrapped around the core;
- microelectronic chip elements disposed between the core and the sheathing fiber, and spaced apart along the sheathed wire;
- and
- at least one wire section connected to each microelectronic chip and disposed between the core and the sheathing fiber, the at least one wire section including a notch forming a preferential breaking point when the wire section is submitted to tensile stress.
Dependencies are inferred from the claim text.