In-mould molding touch module and method for manufacturing the same
AssigneeTPK Touch Solutions Inc.
InventorMin-Yi Lee
Life of this patent
Estimating the term…
Abstract
An in-mold molding touch module includes a plastic film, a touch circuit and a molding rind. The plastic film includes an inner surface and an outer surface for handling and touching. At least one region of the inner surface and a corresponding region of the outer surface define a touch area. The touch circuit is arranged on the inner surface in the touch area. The molding rind is integrated on the inner surface by an in-mold injecting mode to contain the touch circuit for forming a one-piece body. In addition, the invention also provides a method for manufacturing an in-mold molding touch module.
Claims12
A method for manufacturing an in-mould molding touch module, comprising:
- (a) forming a transparent touch circuit on the inner surface of a substrate, wherein the substrate has a transparent region, and the transparent touch circuit is formed corresponding to the transparent region;
- and
- (b) molding a molding rind molded on the substrate being an in-mold injected module to contain the touch circuit forming a one-piece body, wherein the molding rind has a window thereon to expose the transparent touch circuit.
A method for manufacturing an in-mould molding touch module, comprising:
- (a) forming a first touch circuit on a first region of the inner surface of a substrate, wherein the first touch circuit is a transparent touch circuit, the first region of the substrate is a transparent region, and the transparent touch circuit is formed corresponding to the transparent region;
- (b) forming a second touch circuit on a second region of the inner surface of the substrate;
- and
- (c) molding a molding rind molded on the substrate being an in-mold injected module to contain the first touch circuit and the second touch circuit forming a one-piece body, wherein the molding rind has a window thereon to expose the transparent touch circuit.
Dependencies are inferred from the claim text.