Contact and bonding structure of the contact

A contact which is capable of electrically connecting an electrically conductive portion provided on a plate-like member with an electrically conductive member different from the plate-like member, the contact comprising:

• a main body that is to be soldered to the electrically conductive portion provided on the plate-like member, and being configured to have an opening;
• a movable portion, one end of which projects outwardly of the main body from the opening and the other of which is introduced inwardly of the main body from the opening, the movable portion being held by the main body so as to be reciprocable in directions of increasing and decreasing of a projecting amount thereof outwardly of the main body;
• and
• a biasing mechanism that for biasing the movable portion in such a direction that the projecting amount of the movable portion increases,
• the main body including:
• a tubular portion that has the opening formed at an end thereof and is to be inserted into an attachment hole penetrating through the plate-like member when the main body is soldered;
• a solder inflow suppressing portion that is provided on an outer circumferential side of the tubular portion so as to abut the plate-like member around the attachment hole when the tubular portion is inserted into the attachment hole, the solder inflow suppressing portion being capable of suppressing solder melted on an outer circumferential side of an abutting area between the solder inflow suppressing portion and the plate-like member from flowing into an inner circumferential side of the abutting area when the main body is soldered;
• and
• a soldering portion that is provided on an outer circumferential side of the solder inflow suppressing portion and is to be soldered to the electrically conductive portion provided on the plate-like member.