Method for printing a conductor in two superimposed layers by screen-printing
AssigneeCommissariat A L'energie Atomique Et Aux Energies Alternatives
InventorArmand Bettinelli
Life of this patent
Estimating the term…
Abstract
Method for printing on a wafer (1) by screen-printing, characterized in that it comprises the following steps: producing at least two first test-patterns (5a-5d) on the surface (4) of the wafer (1); printing at least four second test-patterns (6a-6d), distinct from the at least two first test-patterns (5a-5d), during printing on the surface (4) of the wafer (1) by screen-printing; measuring the actual distance obtained on the surface (4) of the wafer (1) between the first test-patterns (5a-5d) and the second test-patterns (6a-6d); comparing this actual distance with a theoretical distance in order to deduce therefrom the offset of the screen-printing screen (25) of the printing.
Claims16
Method for printing on a wafer for a photovoltaic cell by screen-printing electrical conductors, wherein the method comprises:
- producing at least two first test-patterns for a first conductive layer on the surface of the wafer;
- printing at least four second test-patterns for a second conductive layer, distinct from the at least two first test-patterns, during printing on the surface of the wafer by screen-printing with screen-printing screen;
- measuring the actual distance obtained on the surface of the wafer between the first test-patterns and the second test-patterns;
- comparing this actual distance with a theoretical distance in order to deduce therefrom an offset of the screen-printing screen of the printing caused by a deformation of the screen-printing screen, wherein the theoretical distance is a distance defined by a alignment of the screen printing without deformation of screen-printing screen,
- wherein the offset determined by the comparison is used to correct a misalignment caused by the deformation of the screen-printing screen.
Dependencies are inferred from the claim text.