Panelized process for SMT sensor devices
AssigneeExcelitas Technologies Singapore Pte. Ltd.
InventorArthur Barlow
Life of this patent
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Abstract
A method is presented for forming multiple surface mount technology (SMT) sensor packages in a panel for separation into individual SMT sensor packages. A base plate is mapped as a grid of sensor footprints, and each footprint is populated with electronic and sensor components. A cover plate including window elements is mapped to a similar grid. The cover plate is bonded to the base plate, such that the window elements are positioned to allow incident electromagnetic radiation upon corresponding sensors mounted on the printed circuit board. Each sensor footprint is sealed within a recess or cell beneath the cover. The sensor circuits may be tested before and/or after being separated into individual SMT sensor packages.
Claims12
A process for manufacturing a surface mount technology (SMT) sensor device, comprising the steps of:
- forming a support substrate;
- mapping a grid comprising a plurality of sensor footprints on said substrate;
- affixing a sensor within each said plurality of sensor footprints;
- forming a lid comprising a plurality of sensor encapsulating covers having transparent members, wherein said plurality of encapsulating covers are configured to correspond to said plurality of sensor footprints in a one-to-one fashion;
- aligning said lid to said support substrate;
- bonding said lid to said support substrate to form a panel, wherein a cavity is formed above each sensor and below each transparent member;
- and
- cutting said panel according to said grid to form an SMT sensor device.
Dependencies are inferred from the claim text.