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US 8,806,742 B2Granted
Method of making an electronic package
AssigneeInternational Business Machines Corporation
InventorsErwin B Cohen, Martin P Goetz, Jennifer V Muncy
Life of this patent
Estimating the term…
Abstract
An electronic package has a cover or lid mounted onto a substrate to enclose an electronic device, and a liquid thermal interface material is subsequently inserted (through dispensing, injection molding or printing through apertures in the cover or lid) between the surface of the electronic device and the cover, and cured to a solid state.
Claims1
Method comprising:
- securing an electronic device to a substrate, then;
- securing to the substrate a cover enclosing the electronic device and defining with the substrate a volume around the electronic device, the cover being spaced from the electronic device and having a plurality of apertures formed therein, then;
- bonding together the cover and the substrate and determining any warpage between surfaces of the inside of the cover and the electronic device, then;
- printing a thermally conductive interface material onto the cover and through the plurality of apertures into the volume defined between the cover and the substrate and filling the apertures and a fractional portion of the volume between the electronic device and the cover, the fractional portion being limited to the space between the cover and the upper surface of the electronic device proximate the cover and accommodating any warpage between surfaces of the inside of the cover and the electronic device, then;
- curing the thermally conductive material in situ within the assembled substrate, device, cover, and aperture.
2 more elements
Dependencies are inferred from the claim text.