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US 8,806,741 B2Granted
Method of making an electronic device
AssigneeInfineon Technologies AG
InventorRalf Otremba
Life of this patent
Estimating the term…
Abstract
An electronic device is disclosed. One embodiment provides a metallic body. A first electrically insulating layer is applied over the metallic body and having a thickness of less than 100 μm. A first thermally conductive layer is applied over the first electrically insulating layer and having a thermal conductivity of more than 50 W/(m·K). A second electrically insulating layer is applied over the first thermally conductive layer and having a thickness of less than 100 μm.
Claims5
A method, comprising:
- providing a metallic body comprising a die pad and a plurality of leads;
- mounting a semiconductor chip on the die pad, the semiconductor chip including an electrode electrically coupled to the die pad;
- encapsulating the semiconductor chip, portions of the die pad outside of a region covered by the semiconductor chip, and portions of the plurality of leads in a mold material;
- depositing a first electrically insulating layer directly on surfaces of the die pad not covered by the mold material from a gas phase;
- depositing a first thermally conductive layer directly on the first electrically insulating layer, and
- depositing a second electrically insulating layer directly on the first thermally conductive layer from a gas phase.
3 more elements
Dependencies are inferred from the claim text.