Silicon chicklet pedestal
AssigneeInternational Business Machines Corporation
InventorsS. Jay Chey, Timothy C. Krywanczyk, Mohammed S. Shaikh, Matthew T. Tiersch, Cornelia Kang-I Tsang
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Abstract
A silicon chicklet pedestal for use in a wafer-level test probe of a wafer is provided and includes a main body, first and second opposing faces, and an array of vias formed through the main body to extend between the first and second faces, through which pairs of leads, respectively associated with each via at the first and second faces, are electrically connectable to one another.
Claims15
A silicon chicklet pedestal, for use in a wafer-level test probe for a wafer, including a main body, first and second opposing faces, and an array of vias formed through the main body to extend between the first and second faces, through which pairs of leads, respectively associated with each via at the first and second faces, are electrically connectable to one another, the silicon chicklet pedestal further comprising insulation, a conductive layer disposed on the insulation and a curable filling at each of the vias.
A silicon chicklet pedestal, comprising:
- a silicon wafer having first and second opposing faces and a main body through which an array of vias each extend between the first and the second faces;
- an insulating layer formed on sidewalls of each of the vias;
- a conductive layer formed on the insulating layer;
- a cured filling, including conductive material, disposed in remaining spaces in each of the vias;
- and
- a pair of leads associated with each of the vias at the first and second faces, the leads of each pair being electrically connectable by the conductive material of the associated via.
Dependencies are inferred from the claim text.