Method of repairing a probe board
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsMyung Whun Chang, Dae Hyeong Lee, Ki Pyo Hong
Life of this patent
Estimating the term…
Abstract
There is provided a method of repairing a probe board, the method including: preparing a plurality of first via electrodes filled with a first filling material in a board body formed as a ceramic sintered body; forming a via hole for an open via electrode among the plurality of first via electrodes; filling the via hole with a second filling material having a lower sintering temperature than that of the first filling material; and forming a second via electrode by sintering the second filling material. The open via repair according to the present invention improves the manufacturing yield of the board and reduces the manufacturing costs thereof.
Claims8
A method of repairing a probe board, the method comprising:
- preparing a plurality of first via electrodes filled with a first filling material in a board body formed as a ceramic sintered body;
- inspecting an open defect in the first filling material of the plurality of first via electrodes;
- removing the first filling material having the open defect from the first via electrodes;
- filling a second filling material, having a lower sintering temperature than that of the first filling material, into a via hole of the first via electrodes from which the first filling material is removed;
- and
- forming a second via electrode by sintering the second filling material.
Dependencies are inferred from the claim text.