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US 8,806,420 B2Granted
In-grid on-device decoupling for BGA
AssigneeAlcatel Lucent
InventorsAlex Chan, Paul James Brown
Life of this patent
Estimating the term…
Abstract
Embodiments of the invention place surface-mount such as decoupling capacitors, resistors or other devices directly on the underside of a ball grid array (BGA) electronic integrated circuit (EIC) package, between BGA pads.
Claims17
An electronic integrated circuit (EIC) package comprising:
- an EIC substrate;
- an array of ball grid array (BGA) pads on a first side of said EIC substrate, wherein the BGA pads are arranged in a grid pattern of rows and columns;
- and contact pads on said first side of said EIC substrate between said BGA pads to accommodate electrical connection of a surface-mount device, wherein the surface-mount device occupies a location between diagonally adjacent BGA pads that is not aligned with any rows and columns in the grid pattern.
A computer-aided design tool for accommodating a surface-mount device on a first side of a ball grid array (BGA) electronic integrated circuit (EIC) package, said computer-aided design tool comprising:
- a device configured to identify, in an EIC configuration of BGA pads in a grid pattern on said first side of said EIC package, at least two contact pads for forming directly on said first side and between said BGA pads, said contact pads for direct mounting of and connection to said surface-mount device, wherein the surface-mount device occupies a location between diagonally adjacent BGA pads that is not aligned with any rows and columns in the grid pattern.
Dependencies are inferred from the claim text.