Integrated circuit pad modeling
AssigneeInternational Business Machines Corporation
InventorsHanyi Ding, Kai D. Feng, Hailing Wang
Life of this patent
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Abstract
A method of modeling an integrated circuit chip includes generating a model of a bond pad using a design tool running on a computer device. The method also includes connecting a first inductor, a first resistor, and a first set of parallel-resistor-inductor elements in series between a first node and a second node in the model. The method further includes connecting a second inductor, a second resistor, and a second set of parallel-resistor-inductor elements in series between the second node and a third node in the model. The first node corresponds to a first signal port of the bond pad. The second node corresponds to a second signal port of the bond pad.
Claims20
A method of modeling an integrated circuit chip, comprising:
- generating a model of a bond pad using a design tool running on a computer device;
- connecting a first inductor, a first resistor, and a first set of parallel-resistor-inductor elements in series between a first node and a second node in the model;
- and
- connecting a second inductor, a second resistor, and a second set of parallel-resistor-inductor elements in series between the second node and a third node in the model;
- wherein the first node corresponds to a first signal port of the bond pad;
- and
- the second node corresponds to a second signal port of the bond pad.
A computer program product for modeling an integrated circuit chip, the computer program product comprising a computer readable storage device having program code embodied therewith, the program code being readable and/or executable by a processor of a computer device to perform a method comprising:
- generating, by the processor, a model of a bond pad;
- connecting, by the processor, a first combination of inductors and resistors between a first node and a second node in the model;
- connecting, by the processor, a second combination of inductors and resistors between the second node and a third node in the model;
- and
- connecting, by the processor, a first capacitor between the first node and a fourth node, a second capacitor between the second node and a fifth node, and a third capacitor between the third node and a sixth node,
- wherein the first node represents a first signal port of the bond pad;
- the second node represents a second signal port of the bond pad;
- and
- the first signal port and the second signal port are at different locations on the bond pad.
A method in a computer-aided design system for generating a functional design model of a bond pad, said method comprising:
- generating, by the computer-aided design system, a functional representation of a first combination of inductors and resistors connected in series between a first node and a second node;
- generating, by the computer-aided design system, a functional representation of a second combination of inductors and resistors connected in series between the second node and a third node;
- and
- generating, by the computer-aided design system, a functional representation of a first capacitor between the first node and a fourth node, a second capacitor between the second node and a fifth node, and a third capacitor between the third node and a sixth node,
- wherein the first node represents a first signal port of the bond pad;
- the second node represents a second signal port of the bond pad;
- and
- the first signal port and the second signal port are at different locations on the bond pad.
Dependencies are inferred from the claim text.