Method for bit-error rate testing of resistance-based RAM cells using a reflected signal
AssigneeAvalanche Technology, Inc.
InventorsZihui Wang, Yuchen Zhou, Jing Zhang, Yiming Huai
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AssigneeAvalanche Technology, Inc.
InventorsZihui Wang, Yuchen Zhou, Jing Zhang, Yiming Huai
Estimating the term…
A testing method is described for performing a fast bit-error rate (BER) measurement on resistance-based RAM cells, such MTJ cells, at the wafer or chip level. Embodiments use one or more specially designed test memory cells fabricated with direct electrical connections between the two electrodes of the cell and external contact pads (or points) on the surface of the wafer (or chip). In the test setup the memory cell is connected an impedance mismatched transmission line through a probe for un-buffered, fast switching of the cell between the high and low resistance states without the need for CMOS logic to select and drive the cell. The unbalanced transmission line is used generate signal reflections from the cell that are a function of the resistance state. The reflected signal is used to detect whether the test cell has switched as expected.
A method for testing a memory cell, the memory cell having a low resistance state and a high resistance state that can be switched by predetermined voltage pulses applied to the memory cell, the method comprising:
An apparatus for testing a memory cell having a low resistance state and a high resistance state that can be switched by positive and negative voltage pulses applied to the memory cell, comprising:
Dependencies are inferred from the claim text.