Macro-channel water-cooled heat-sink for diode-laser bars

Diode-laser apparatus, comprising:

• a plurality of diode-laser assemblies, each thereof including an electrically insulating, ceramic sub-mount having a high thermal conductivity, and first and second opposite sides, and including a diode-laser bar solder-bonded to the first side of the ceramic sub-mount;
• a heat-sink assembly including a base-unit and a copper cooling-unit, each thereof having first and second opposite sides, the cooling-unit and the base-unit being attached together with the first side of the base-unit mating with the second side of the cooling-unit;
• the copper cooling-unit having a plurality of integral elongated rectangular mounting-members extending from the first side of the cooling-unit the mounting-members being spaced apart and parallel to each other, and each diode-laser bar assembly being bonded to a corresponding one of the mounting-members and emission direction of the diode-laser bar parallel to the extension direction of the mounting-members;
• a plurality of cooling-channels, one formed in each of the mounting-members, and each thereof having opposite first and second ends, each of the cooling-channels being formed from an elongated slot having a depth and a first length formed in the second side of the cooling-unit and extending into a corresponding one of the mounting-members, and an integral extension on the first side of the base-unit having height less than the depth of the slot, and a second length less than the first length, and extending partially into the slot leaving an open portion at each end thereof providing the input and output ends of the cooling-channel;
• and
• the base-unit including an input-passage for directing water into the first ends of the cooling-channels and an output-passage for conducting water away from the second ends of the cooling-channel.