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US 8,804,781 B2Granted
Macro channel water-cooled heat-sink for diode-laser bars
AssigneeCoherent, Inc.
InventorsDavid Schleuning, Athanasios Chryssis
Life of this patent
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Abstract
A diode-laser bar is mounted on water-cooled heat-sink between two ceramic sub-mounts for electrically isolating cooling-water in the heat-sink from the diode-laser bar. Mounting between the two ceramic sub-mounts also provides for balancing stresses due to differences in coefficient of thermal expansion (CTE) between the sub-mounts and the diode-laser bar. Both sub-mounts are in thermal communication with the heat-sink for providing two-sided cooling of the diode-laser bar.
Claims18
Diode-laser apparatus, comprising:
- a heat-sink, the heat-sink comprising:
- a base,
- first and second cooling-members spaced apart, facing each other, and in thermal communication with the base, and
- first and second thermally conductive, electrically insulating, sub-mounts of a ceramic material, each thereof having first and second opposite surfaces;
- and
- a diode-laser bar assembly located between the first and second cooling-members, the diode-laser bar assembly including a diode-laser bar solder-bonded between the first surfaces of the first and second sub-mounts, with the second surfaces of the first and second sub-mounts in thermal communication with respectively the first and second cooling-members.
3 more elements
Diode-laser apparatus, comprising:
- a heat-sink, the heat sink comprising:
- a base,
- a mounting platform on the base, and
- first and second thermally conductive, electrically insulating, sub-mounts of a ceramic material, each thereof having first and second opposite surfaces;
- and
- a diode-laser bar assembly mounted on the mounting-platform, the diode-laser bar assembly including a diode-laser bar having an emission direction parallel to the mounting platform and being solder-bonded between the first surfaces of the first and second sub-mounts, with the second surface of the first sub-mount solder-bonded to the mounting platform;
- a cooling-block mounted on the second surface of the second sub-mount in thermal communication with the sub-mount and the base.
4 more elements
Diode-laser apparatus, comprising:
- a heat-sink, the heat sink comprising:
- a base,
- first and second cooling-members extending from the base, the first and second cooling-members being spaced apart, facing each other, and in thermal communication with the base, and
- first and second thermally conductive, electrically insulating, sub-mounts of a ceramic material, each thereof having first and second opposite surfaces;
- and
- a diode-laser bar assembly located between the first and second cooling-members, the diode-laser bar assembly including a diode-laser bar having an emission direction in the direction of extension of the cooling members and being solder-bonded between the first surfaces of the first and second sub-mounts, with the second surfaces of the first and second sub-mounts in thermal communication with respectively the first and second cooling-members.
3 more elements
Dependencies are inferred from the claim text.