Downward-facing optical component module

A motherboard, comprising:

• a main PCB having an upper component surface and a lower surface;
• a carrier PCB having a top surface and a bottom surface;
• the carrier PCB comprising at least one component coupled to the top surface of the carrier PCB;
• the main PCB further comprising a through-hole extending between the upper component surface and the lower surface of the main PCB;
• wherein the carrier PCB is mounted in an inverted orientation with respect to the main PCB such that the top surface of the carrier PCB faces the upper component surface of the main PCB;
• wherein the carrier PCB is aligned with the main PCB such that the component is substantially aligned with the through hole of the main PCB and is visible from the lower surface of the main PCB;
• and
• wherein the component comprises a sensor, and wherein the sensor senses through the through-hole in the direction of the lower surface of the main PCB.

An electronic device, comprising:

• a main PCB having an upper component surface and a lower surface;
• wherein the main PCB comprises a single-sided PCB having one or more control components mounted to the upper component surface;
• a carrier module having a top surface and a bottom surface;
• the carrier module comprising at least one optical component coupled to the top surface of the carrier module;
• the main PCB further comprising a through-hole extending between the upper component surface and the lower surface of the main PCB;
• wherein the carrier module is mounted in an inverted orientation with respect to the main PCB such that the top surface of the carrier module faces the upper component surface of the main PCB;
• and
• wherein the carrier module is aligned with the main PCB such that the optical component is visible from the lower surface of the main PCB and operates in a line of sight through the main PCB toward the lower surface of the main PCB.

An electronic device, comprising:

• a first single-sided printed circuit board (PCB);
• a second single-sided PCB configured to be coupled to the first PCB;
• the first PCB having a top component surface and bottom surface and at least one component mounted to the top component surface prior to the first PCB being coupled to the second PCB;
• the second PCB comprising a top component surface and a bottom surface;
• the second PCB further comprising a through-hole extending between the top component surface and bottom surface of the second PCB;
• wherein the first PCB is mounted in an inverted orientation with respect to the second PCB such that the top component surface of the first PCB faces the top component surface of the second PCB;
• wherein the first PCB is aligned with the second PCB such that the component is substantially aligned with the through hole of the second PCB and is visible from the bottom surface of the second PCB;
• and
• wherein the component comprises an optical device that operates in a line of sight through the second PCB toward the bottom surface of the second PCB.