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US 8,804,366 B2Granted
Package-based filtering and matching solutions
AssigneeIntel Corporation
InventorsTelesphor Kamgaing, Emile Davies-Venn
Life of this patent
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Abstract
A microelectronic package having a radio frequency (RF) amplifier circuit and, incorporating harmonic rejection filters and matching circuits integrally formed in the package is disclosed. A harmonic rejection filter may comprise a metal-insulator-metal (MIM) capacitor serially coupled between bond pads disposed on a RF amplifier circuit die, a first wire bond coupling a first bond pad to a package output, where the first bond pad is coupled to the output of the RF amplifier, and a second wire bond coupling a second bond pad to a package ground. The harmonic rejection filter may be appropriately configured to filter one or more harmonics at different frequencies.
Claims5
A method of operating a microelectronic package, comprising:
- receiving a signal;
- processing the signal through a first filter integrally formed microelectronic package to provide a first harmonic rejection, the first filter including:
- a first metal-insulator-metal (MIM) capacitor serially coupled between a plurality of the bond pads formed on a die having at least a radio frequency (RF) amplifier circuit formed thereon;
- a first wire bond coupling a first of the bond pads to a package output, wherein the first of the bond pads is coupled to an amplifier output;
- a second wire bond coupling a second of the bond pads to a package ground;
- and
- transmitting the signal to an output of the microelectronic package;
- processing the signal through a second filter integrally formed in the microelectronic package to provide a second harmonic rejection, the second filter including:
- a second MIM capacitor coupled in parallel to the first MIM capacitor and between the first and a third of the bond pads;
- a third wire bond coupling the first of the bond pads to the output of the microelectronic package;
- and
- a fourth wire bond coupling the third of the bond pads to the package ground.
9 more elements
A method of operating a microelectronic package, comprising:
- receiving a signal;
- processing the signal through a first filter integrally formed microelectronic package to provide a first harmonic rejection, the first filter including:
- a first metal-insulator-metal (MIM) capacitor serially coupled between a plurality of the bond pads formed on a die having at least a radio frequency (RF) amplifier circuit formed thereon;
- a first wire bond coupling a first of the bond pads to a package output, wherein the first of the bond pads is coupled to an amplifier output;
- a second wire bond coupling a second of the bond pads to a package ground;
- and
- transmitting the signal to an output of the microelectronic package;
- processing the signal through an output matching circuit integrally formed in the microelectronic package, the output matching circuit including:
- an output matching MIM capacitor coupled in parallel to the first MIM capacitor between the first of the bond pads and the package ground;
- and
- an inductor coupled between the amplifier output and the first of the bond pads.
8 more elements
A method of operating a microelectronic package, comprising:
- receiving a signal;
- processing the signal through a first filter integrally formed microelectronic package to provide a first harmonic rejection, the first filter including:
- a first metal-insulator-metal (MIM) capacitor serially coupled between a plurality of the bond pads formed on a die having at least a radio frequency (RF) amplifier circuit formed thereon;
- a first wire bond coupling a first of the bond pads to a package output, wherein the first of the bond pads is coupled to an amplifier output;
- a second wire bond coupling a second of the bond pads to a package ground;
- processing the signal through a second filter integrally formed in the microelectronic package to provide a second harmonic rejection, the second filter including:
- a second MIM capacitor coupled in parallel to the first MIM capacitor and between the first and a third of the bond pads;
- a third wire bond coupling the first of the bond pads to the output of the microelectronic package;
- and
- a fourth wire bond coupling the third of the bond pads to the package ground;
- and
- transmitting the signal to an output of the microelectronic package.
9 more elements
A method of operating a microelectronic package, comprising:
- receiving a signal;
- processing the signal through a first filter integrally formed microelectronic package to provide a first harmonic rejection, the first filter including:
- a first metal-insulator-metal (MIM) capacitor serially coupled between a plurality of the bond pads formed on a die having at least a radio frequency (RF) amplifier circuit formed thereon;
- a first wire bond coupling a first of the bond pads to a package output, wherein the first of the bond pads is coupled to an amplifier output;
- a second wire bond coupling a second of the bond pads to a package ground;
- processing the signal through an output matching circuit integrally formed in the microelectronic package, the output matching circuit including:
- an output matching MIM capacitor coupled in parallel to the first MIM capacitor between the first of the bond pads and the package ground;
- and
- an inductor coupled between the amplifier output and the first of the bond pads;
- processing the signal through a second filter integrally formed in the microelectronic package to provide a second harmonic rejection, the second filter including:
- a fourth MIM capacitor coupled in parallel to the first MIM capacitor and between the first and a fourth of the bond pads;
- and
- a fourth wire bond coupling the fourth of the bond pads to the package ground;
- and
- transmitting the signal to an output of the microelectronic package.
12 more elements
Dependencies are inferred from the claim text.