Back to results
US 8,804,364 B2Granted
Footprint on PCB for leadframe-based packages
AssigneeMediatek Inc.
InventorHao-Jung Li
Life of this patent
Estimating the term…
Abstract
A footprint of a printed circuit board (PCB) for a leadframe-based package includes a plurality of pads arranged within a central region on a main surface of the PCB; and an array of signal pads disposed within a peripheral region surrounding the central region.
Claims20
A footprint of a printed circuit board (PCB) for a leadframe-based package, the PCB having a main surface, the footprint comprising:
- a plurality of pads arranged within a central region on the main surface of the PCB;
- and
- an array of signal pads disposed within a peripheral region surrounding the central region, wherein a surface area of each of the plurality of pads arranged within the central region is bigger than a surface area of each of the array of signal pads disposed within the peripheral region, wherein a total surface area of the plurality of pads arranged within the central region is less than 50% of the surface area of the central region.
A printed circuit board assembly (PCBA), comprising:
- a footprint of a printed circuit board (PCB), comprising a plurality of pads arranged within a central region on a main surface of the PCB, and an array of signal pads disposed within a peripheral region surrounding the central region;
- and
- a leadframe-based package mounted on the footprint, wherein a surface area of each of the plurality of pads arranged within the central region is bigger than a surface area of each of the array of signal pads disposed within the peripheral region, wherein a total surface area of the plurality of pads arranged within the central region is less than 50% of the surface area of the central region.
Dependencies are inferred from the claim text.