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US 8,804,362 B2Granted
High-frequency module
AssigneeMurata Manufacturing Co., Ltd.
InventorTakanori Uejima
Life of this patent
Estimating the term…
Abstract
In a high-frequency module, a laminate including a plurality of dielectric layers each including an electrode pattern located thereon, and a switch element which includes a test terminal arranged to output a negative voltage applied to the switch element and which is mounted on the laminate, are integrally formed. A test external terminal for external connection which outputs a signal to the outside is provided on a back surface of the laminate. The laminate includes a voltage transmission path electrically connecting the test terminal to the test external terminal.
Claims4
A high-frequency module comprising:
- a laminate including a plurality of dielectric layers each including an electrode pattern located thereon;
- a power supply circuit section arranged to output a voltage to operate the high-frequency module;
- and a high-frequency integrated circuit mounted on a front surface of the laminate;
- wherein the high-frequency integrated circuit includes a test terminal connected to the power supply circuit section to check a voltage of the power supply circuit section;
- the laminate includes an external terminal provided on a back surface thereof to output a signal to an outside;
- and the test terminal and the external terminal are connected to each other through a voltage transmission path defined by the electrode pattern;
- wherein the high-frequency integrated circuit includes at least one common terminal and a plurality of individual terminals;
- the high-frequency integrated circuit is a switching element arranged to switch a path that connects the common terminal to the plurality of individual terminals;
- the laminate includes a plurality of communication signal paths electrically connecting the external terminal through an electrode located on an uppermost layer defining the front surface of the laminate to an electrode located on a lowermost layer defining the back surface of the laminate;
- and the communication signal paths are arranged so as not to overlap the voltage transmission path in a lamination direction.
7 more elements
A high-frequency module comprising:
- a laminate including a plurality of dielectric layers each including an electrode pattern located thereon;
- a power supply circuit section arranged to output a voltage to operate the high-frequency module;
- and a high-frequency integrated circuit mounted on a front surface of the laminate;
- wherein the high-frequency integrated circuit includes a test terminal connected to the power supply circuit section to check a voltage of the power supply circuit section;
- the laminate includes an external terminal provided on a back surface thereof to output a signal to an outside;
- and the test terminal and the external terminal are connected to each other through a voltage transmission path defined by the electrode pattern;
- wherein the high-frequency integrated circuit includes at least one common terminal and a plurality of individual terminals;
- the high-frequency integrated circuit is a switching element arranged to switch a path that connects the common terminal to the plurality of individual terminals;
- the laminate includes a dielectric layer including a ground electrode located thereon, and a plurality of communication signal paths electrically connecting the external terminal through an electrode located on an uppermost layer defining the front surface of the laminate to an electrode located on a lowermost layer defining the back surface of the laminate;
- and at least a portion of the communication signal paths is arranged so as to sandwich the voltage transmission path and the ground electrode in a lamination direction of the laminate.
7 more elements
Dependencies are inferred from the claim text.