System-in packages
AssigneeMegit Acquisition Corp.
InventorsMou-Shiung Lin, Jin-Yuan Lee
Life of this patent
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Abstract
System-in packages, or multichip modules, are described which can include multi-layer chips and multi-layer dummy substrates over a carrier, multiple through vias blindly or completely through the multi-layer chips and completely through the multi-layer dummy substrates, multiple metal plugs in the through vias, and multiple metal interconnects, connected to the metal plugs, between the multi-layer chips. The multi-layer chips can be connected to each other or to an external circuit or structure, such as mother board, ball grid array (BGA) substrate, printed circuit board, metal substrate, glass substrate, or ceramic substrate, through the metal plugs and the metal interconnects.
Claims11
A system-in package comprising:
- a carrier;
- a first chip supported by the carrier, the first chip comprising a first semiconductor substrate having a first surface on a dielectric layer and a second surface opposite the first surface, in which a first conductive layer is between the dielectric layer and the carrier;
- a second chip supported by the carrier, the second chip comprising a second semiconductor substrate having a second surface substantially coplanar with the second surface of the first semiconductor substrate, in which the second chip is separated from the first chip;
- a gap filling material disposed in a gap between the first chip and the second chip;
- a first conductive plug in the first chip, in which the first conductive plug passes through the first semiconductor substrate and the dielectric layer and contacts the first conductive layer;
- a first insulating material enclosing the first conductive plug, in which the first insulating material is enclosed by the first semiconductor substrate;
- and
- a first dielectric structure on the second surface of the first semiconductor substrate, on the second surface of the second semiconductor substrate, and on the gap filling material;
- a first conductive interconnect in the first dielectric structure, in which the first conductive interconnect is coupled to the first conductive plug.
Dependencies are inferred from the claim text.