Method of forming an electronic multichip module

A method of forming a module having electrical interconnections along predefined paths between at least two substrates, at least one of the substrates comprising a functional superconducting electronic device, comprising:

• providing first and second substrates, one of the substrates comprising the functional superconducting device, each having corresponding sets of predefined electrical contacts;
• curing an adhesive surrounding the sets of predefined electrical contacts, said cured adhesive comprising a stable solid matrix adhering to the first and second substrates;
• and
• maintaining mutual compression and electrical conductivity between the corresponding sets of predefined electrical contacts over at least a range of temperatures between about +50 C to −175 C due to the cured adhesive;
• wherein the corresponding sets of predefined electrical contacts are not thermally welded together.

An electronic multichip module formed by a method comprising:

• providing at least two electrically interconnected substrates, at least one of the substrates having a deformable metal in a contact region;
• providing an insulating liquid curable adhesive over the set of contacts of at least a first of the substrates;
• aligning respective sets of electrical contacts of the first and a second substrates, one of the substrate comprised a functional superconducting device;
• compressing the sets of electrical contacts of the first and second substrates below a reflow temperature of the deformable metal to deform the deformable metal and exclude the insulating liquid curable adhesive from an intercontact zone;
• curing the liquid curable adhesive to form a solid matrix while generating a prestress to maintain a compressive force between the respective sets of electrical contacts;
• and
• maintaining adhesion and mechanical integrity of the cured liquid curable adhesive over at least a range of temperatures between about +50 C to −175 C,
• wherein the sets of electrical contacts remain separable.