Power semiconductor package with double-sided cooling
AssigneeInternational Rectifier Corporation
InventorHenning M. Hauenstein
Life of this patent
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Abstract
According to an exemplary embodiment, a power semiconductor package includes a power module having a plurality of power devices. Each of the plurality of power devices can be a power switch. The power semiconductor package also includes a double-sided heat sink with a top side in contact with a plurality of power device top surfaces and a bottom side in contact with a bottom surface of the power module. The power semiconductor package can include at least one fastening clamp pressing the top side and the bottom side of the double-sided heat sink into the power module. The double-sided heat sink can also include a water-cooling element.
Claims20
A power semiconductor package comprising:
- a power module comprising a plurality of power devices;
- said plurality of power devices having a corresponding plurality of power device top surfaces;
- a double-sided heat sink with a top side in thermal contact with said plurality of power device top surfaces, with a bottom side in contact with a bottom surface of said power module, and with at least one connecting portion joining said top side and said bottom side;
- wherein at least one of said plurality of power device top surfaces forms part of a power bus connecting at least two transistors of said plurality of power devices.
Dependencies are inferred from the claim text.