Power electronics assemblies, insulated metal substrate assemblies, and vehicles incorporating the same

A vehicle comprising:

• an inverter circuit comprising a power electronics assembly, the power electronics assembly comprising:
• a semiconductor device;
• a direct-bonded insulated metal substrate comprising a dielectric layer positioned between and direct-bonded to a first metal layer and a second metal layer, and a plurality of stress-relief through-features extending through the first metal layer, the second metal layer and, the dielectric layer, wherein the semiconductor device is thermally coupled to the first metal layer and the plurality of stress-relief through-features is positioned around the semiconductor device;
• and
• a cooling structure thermally coupled to the second metal layer and operable to remove heat flux generated by the semiconductor device during operation of the power electronics assembly;
• and
• an electric motor electrically coupled to the inverter circuit and mechanically coupled to a plurality of wheels.

A direct-bonded insulated metal substrate assembly comprising:

• a first metal layer configured to be bonded to a heat generating device;
• a second metal layer;
• a thermally conductive dielectric layer positioned between and direct-bonded to the first and second metal layers;
• a plurality of stress-relief through-features extending through the first metal layer, the second metal layer, and the thermally conductive dielectric layer, wherein the plurality of stress-relief through-features is positioned around a perimeter of the first metal layer and the second metal layer;
• and
• a cooling structure directly bonded to the second metal layer, wherein the cooling structure is operable to remove heat flux from the heat generating device coupled to the first metal layer.