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US 8,804,111 B2Granted
Multichip CCD camera inspection system
AssigneeKLA-Tencor Corporation
InventorBoris Golovanevsky
Life of this patent
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Abstract
In one embodiment, a surface inspection system comprises a radiation source that emits a broadband radiation beam, a radiation directing assembly to target radiation onto a surface of an object, the radiation directing assembly comprising a radiation collection assembly to collect radiation reflected from the surface of the object, the radiation collection assembly comprising at least one multi-chip detector array assembly positioned within a field of view of the inspection system.
Claims8
A surface inspection system, comprising:
- a radiation source that emits a broadband radiation beam,
- a radiation directing assembly to target the broadband radiation beam onto the surface,
- a radiation collection assembly to collect radiation reflected from the surface,
- a multi-chip detector array, comprising,
- a prism to divide the collected radiation into a first visible radiation band that exits the prism on a first face of the prism, and a second infrared and above radiation band that exits the prism on a second face of the prism that is different from the first face of the prism,
- a first chip glued to the first face of the prism by an index matched optical epoxy, the first chip to receive only the first radiation band and produce an image of the surface, and
- a second chip glued to the second face of the prism by an index matched optical epoxy, the second chip to receive only the second radiation band and produce focus data for the radiation collection assembly,
- where a thermal expansion coefficient of the prism substantially matches a thermal expansion coefficient of both the first chip and the second chip.
5 more elements
Dependencies are inferred from the claim text.