Method of manufacturing a display device comprising a step of simultaneously polishing a second substrate and a semiconductor chip to have the same thickness as each other

A method of manufacturing a display device having a first substrate with a pixel switch and drivers mounted thereon, a second substrate disposed in facing relation to said first substrate, and a material layer held between said first substrate and said second substrate and sealed by a seal member, the method comprising:

• a first step of mounting a semiconductor chip having a control system configured to control said drivers, as a COG component on said first substrate parallel to a region in which said seal member and said second substrate are stacked;
• a second step of filling a space around said semiconductor chip with a protective fixing member thereby to secure said first substrate and said semiconductor chip to each other;
• and
• a third step of simultaneously polishing said second substrate and said semiconductor chip to the same thickness as each other.