Miniaturized wide-band baluns for RF applications

A balun device, comprising:

• a first coil formed at a first level over a substrate in a wound configuration extending horizontally across the substrate;
• a second coil formed at the first level over the substrate in a wound configuration adjacent to the first coil, the second coil being magnetically coupled to the first coil;
• and
• a third coil formed over the substrate in a wound configuration adjacent to the first coil and second coil, the third coil being magnetically coupled to the first coil and second coil;
• wherein the first, second, and third coils have a substantially flat vertical profile with respect to each other and are arranged over the substrate as a single integrated structure.

A balun for a semiconductor device, comprising:

• a first metallization formed over a substrate and patterned as a first coil extending horizontally across the substrate;
• a second metallization formed over the substrate and patterned as a second coil adjacent to the first coil, the second metallization being magnetically coupled to the first metallization;
• and
• a third metallization formed over the substrate and patterned as a third coil adjacent to the first coil and second coil, the third metallization being magnetically coupled to the first metallization and second metallization;
• wherein the first and second metallizations have a substantially flat vertical profile with respect to each other and are arranged over the substrate as a single integrated structure.

A method of manufacturing a balun, comprising:

• forming a first metallization over a substrate patterned as a first coil extending horizontally across the substrate;
• forming a second metallization over the substrate patterned as a second coil including a substantially flat vertical profile with respect to the first coil, the second metallization being magnetically coupled to the first metallization;
• and
• forming a third metallization over the substrate patterned as a third coil adjacent to the first coil and second coil, the third metallization being magnetically coupled to the first metallization and second metallization;
• arranging the first, second, and third metallizations over the substrate as a single integrated structure.

A method of making a balun, comprising:

• forming a first metallization over a substrate patterned as a first coil;
• forming a second metallization over the substrate patterned as a second coil, the second metallization being magnetically coupled to the first metallization;
• and
• forming a third metallization over the substrate patterned as a third coil adjacent to the first coil and second coil, the third metallization being magnetically coupled to the first metallization and second metallization.

A balun device, comprising:

• a first metallization formed over a substrate patterned as a first coil;
• a second metallization formed over the substrate patterned as a second coil, the second metallization being magnetically coupled to the first metallization;
• and
• a third metallization formed over the substrate patterned as a third coil adjacent to the first coil and second coil, the third metallization being magnetically coupled to the first metallization and second metallization.