Solid-state imaging device

A solid-state imaging device, comprising:

• a semiconductor element layer having a pixel region in which a plurality of photodiodes are provided and a peripheral circuit region in which a peripheral circuit for processing of signals generated from the pixels is provided;
• a power supply line to supply an electric power to the peripheral circuit, provided at a first side of the semiconductor element layer in the peripheral circuit region;
• a first wiring layer to supply the electric power to the power supply line, provided at a second side of the semiconductor element layer in the peripheral circuit region;
• and
• a plurality of first through-electrodes, provided in the peripheral circuit region and passing through the semiconductor element layer between the first side and the second side,
• wherein at least a part of the first through-electrodes electrically connect between the power supply line and the first wiring layer.