Integrated circuit chip and testing method capable of detecting connection error
AssigneeMStar Semiconductor, Inc.
InventorsChih-Cheng Ku, Shan-Cheng Sun, You-Kuo Wu
Life of this patent
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Abstract
An integrated circuit chip is provided. The integrated circuit chip includes a pad, a first resistor, a second resistor, a first switch, a second switch and a controller. The first resistor and the first switch are serially connected between the pad and a first reference voltage terminal. The second resistor and the second switch are serially connected between the pad and a second reference voltage terminal. The controller selectively turns on and off the first and second switches according to an error determining mechanism. The error determining mechanism determines whether an error condition associated with the pad is present.
Claims16
An integrated circuit chip, comprising:
- a pad;
- a first resistor and a first switch, serially connected between the pad and a first reference voltage terminal;
- a second resistor and a second switch, serially connected between the pad and a second reference voltage terminal;
- and
- a controller selectively turning on and off the first switch and the second switch according to an error determining mechanism, the error determining mechanism being followed for determining whether an error condition associated with the pad is present;
- wherein, a voltage of the first reference voltage terminal is different from a voltage of the second reference voltage terminal.
A chip testing method, applied to an integrated circuit chip, the integrated circuit chip comprising a pad, a first resistor, a first switch, a second resistor and a second switch, the first resistor and the first switch being serially connected between the pad and a first reference voltage terminal, the second resistor and the second switch being serially connected between the pad and a second reference voltage terminal, a voltage of the second voltage terminal being different from a voltage of the first voltage terminal, the method comprising:
- measuring a voltage at a testing point associated with the pad to generate a first test result after turning on the first switch and turning off the second switch;
- measuring a voltage at the testing point to generate a second test result after turning on the second switch and turning off the first switch;
- and
- determining whether an error condition is present according to the first test result and the second test result.
Dependencies are inferred from the claim text.