Compliant wafer level probe assembly
AssigneeHsio Technologies, LLC
InventorJames Rathburn
Life of this patent
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AssigneeHsio Technologies, LLC
InventorJames Rathburn
Estimating the term…
A probe assembly that acts as a temporary interconnect between terminals on a circuit member and a test station. The probe assembly can include a base layer of a dielectric material printed onto a surface of a fixture. The surface of the fixture can have a plurality of cavities. A plurality of discrete contact members can be formed in the plurality of cavities in the fixture and coupled to the base layer. A plurality of conductive traces can be printed onto an exposed surface of the base layer and electrically coupled with proximal ends of one or more of the discrete contact members. A compliant layer can be deposited over the conductive traces and the proximal ends of the contact members. A protective layer can be deposited on the compliant layer such that when the probe assembly is removed from the fixture the distal ends of the contact members contact terminals on the circuit member and the conductive traces electrically couple the circuit member to a test station. Electrical devices on the probe assembly can communicate with the test station to provide adaptive testing.
A probe assembly to act as a temporary interconnect between terminals on a circuit member and a test station, the probe assembly comprising:
A testing system for electrical devices comprising:
A method of forming a probe assembly comprising the steps of:
Dependencies are inferred from the claim text.