High intensity light source
AssigneeSoraa, Inc.
InventorsFrank Tin Chung Shum, Clifford Jue
Life of this patent
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Abstract
A light source comprises a heat-sink having a mounting region, and heat-dissipating fins, a base housing having an inner cavity and coupled to the heat-sink, and an integrated lighting module including: a printed circuit board; an LED on a substrate coupled to the printed circuit board within a first lateral region of the printed circuit board, and an electronic driving circuit for providing power to the LED and coupled to the printed circuit board within a second lateral region of the printed circuit board, wherein a bottom surface of the substrate is thermally coupled to the mounting region of the heat-sink, and wherein the second lateral region of the integrated lighting module is located within the inner cavity of the base housing.
Claims22
A light source comprising:
- a heat-sink comprising;
- an inner core region;
- a mounting region disposed within the inner core region;
- and
- a plurality of heat-dissipating fins extending from the inner core region;
- wherein the plurality of heat-dissipating fins and the mounting region define an inner cavity and a through slot adjacent the mounting region;
- a base housing disposed within the inner cavity;
- and
- an integrated lighting module comprising:
- a flexible printed circuit;
- a light emitting source formed on a top surface of a substrate, wherein the top surface of the substrate is mechanically and electrically coupled to a first region of the flexible printed circuit;
- an electronic driving circuit configured to provide electrical power to the light emitting source, wherein the electronic driving circuit is mechanically and electrically coupled to a second region of the flexible printed circuit;
- and
- an electrical connector mechanically and electrically coupled to an end of the flexible printed circuit;
- wherein:
- a bottom surface of the substrate is mechanically and thermally coupled to the mounting region of the heat-sink,
- the second region of the flexible printed circuit is disposed within the base housing, and
- a portion of the flexible printed circuit between the first region and the second region is disposed within the through slot.
A method for assembling a light source, the method comprising:
- receiving a heat-sink comprising an inner core region, a mounting region disposed within the inner core region, and a plurality of heat-dissipating structures extending from the inner core region, wherein the plurality of heat-dissipating structures and the mounting region define an inner cavity and a through slot adjacent the mounting region;
- receiving a base housing disposed within the inner cavity;
- receiving an integrated lighting module, wherein the integrated lighting module comprises a flexible printed circuit having a first region and a second region, the first region being mechanically and electrically coupled to a top surface of a light emitting source substrate, and within the second region being mechanically and electrically coupled to a plurality of electronic driving devices, and wherein the light emitting source substrate comprises a light emitting source;
- disposing the second region of the flexible printed circuit within the base housing;
- disposing a portion of the flexible printed circuit between the first region and the second region within the through slot;
- and
- mechanically and thermally coupling a bottom surface of the light emitting source substrate to the mounting region of the heat-sink.
Dependencies are inferred from the claim text.