Integrated circuit structure having dies with connectors
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsJing-Cheng Lin, Cheng-Lin Huang
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Abstract
An embodiment is an integrated circuit structure including a first die attached to a second die by a first connector. The first connector includes a solder joint portion between a first nickel-containing layer and a second nickel-containing layer, a first copper-containing layer between the first nickel-containing layer and the solder joint portion, and a second copper-containing layer between the second nickel-containing layer and the solder joint portion.
Claims20
An integrated circuit structure comprising:
- a first die comprising a first bump structure;
- and
- a second die comprising a second bump structure,
- wherein the first die is attached to the second die by bonding the first bump structure and the second bump structure;
- and
- wherein the first bump structure comprises:
- a first metal pillar comprising copper;
- a first metal cap layer comprising nickel on the first metal pillar;
- a first metal insertion layer comprising copper on the first metal cap layer;
- and
- a first solder layer on the first metal insertion layer.
An integrated circuit structure comprising:
- a first die attached to a second die by a first connector,
- wherein the first connector comprises:
- a solder joint portion between a first nickel-containing layer and a second nickel-containing layer;
- a first copper-containing layer between the first nickel-containing layer and the solder joint portion;
- and
- a second copper-containing layer between the second nickel-containing layer and the solder joint portion.
A method of forming an integrated circuit structure comprising:
- forming on a first die a first bump structure by
- forming a first metal pillar comprising copper;
- forming a first metal cap layer comprising nickel on the first metal pillar;
- forming a first metal insertion layer comprising copper on the first metal cap layer;
- and
- forming a first solder layer on the first metal insertion layer
- forming on a second die a second bump structure by
- forming a second metal pillar comprising copper,
- forming a second metal cap layer comprising nickel on the first metal pillar;
- forming a second metal insertion layer comprising copper on the first metal cap layer;
- and
- forming a second solder layer on the first metal insertion layer;
- and
- bonding the first structure to the second bump structure.
Dependencies are inferred from the claim text.