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US 8,803,332 B2Granted
Delamination resistance of stacked dies in die saw
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsBo-I Lee, Tsung-Ding Wang
Life of this patent
Estimating the term…
Abstract
An integrated circuit structure includes a first die including TSVs; a second die over and bonded to the first die, with the first die having a surface facing the second die; and a molding compound including a portion over the first die and the second die. The molding compound contacts the surface of the second die. Further, the molding compound includes a portion extending below the surface of the second die.
Claims20
An integrated circuit structure comprising:
- a first die comprising at least one through-substrate via (TSV), the first die further comprising a first surface and a second surface opposite the first surface, the second surface having at least one redistribution line disposed thereon, the at least one TSV extending from the at least one redistribution line through the first die and above the first surface;
- a second die over and bonded to the first die, the first surface of the first die spaced apart from and facing the second die, the second die in electrical contact with the at least one TSV;
- a molding compound comprising a portion over the first die and the second die, wherein the molding compound contacts the first surface of the first die, and wherein the molding compound comprises a first portion extending below the first surface of the first die and further comprises a bottom surface that is about level with the second surface of the first die;
- at least one connector different from the at least one TSV and disposed on the second surface of the first die;
- and
- a package substrate underlying and bonded to the first die by the at least one connector, wherein the molding compound is spaced apart from the package substrate.
3 more elements
An integrated circuit structure comprising:
- a bottom die comprising through-substrate vias (TSVs), the TSVs extending through bottom die and above a first side, the bottom die having a second side opposite the first side;
- a top die over and bonded to the TSVs of the bottom die, the first side of the bottom die facing the top die;
- a molding compound comprising a first portion over the bottom die and the top die, a second portion contacting side edges of the bottom die and the top die, and a bottommost surface level with a bottom surface of the bottom die;
- and
- a package substrate underlying and bonded at a first side to the second side of the bottom die by first connectors different than the TSVs, the package substrate spaced apart from the bottom die, the package substrate having second connectors mounted on a second side opposite the first side;
- wherein edges of the molding compound are misaligned with respective edges of the package substrate.
3 more elements
A method of forming an integrated circuit structure, the method comprising:
- mounting a mounting material in a liquid form onto a carrier;
- curing the mounting material;
- placing a bottom die on the cured mounting material;
- bonding a top die over the bottom die, wherein the bottom die comprises a surface facing the top die, and wherein the bottom die comprises through-substrate vias (TSVs) therein;
- molding a molding compound onto the bottom die and the top die, wherein the molding compound contacts the surface of the top die, and wherein the molding compound comprises a portion extending below the surface of the top die;
- and
- after the molding compound is molded, sawing the molding compound.
4 more elements
Dependencies are inferred from the claim text.