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US 8,803,330 B2Granted
Integrated circuit package system with mounting structure
AssigneeSTATS ChipPAC, Ltd.
InventorsRui Huang, Seng Guan Chow, Heap Hoe Kuan
Life of this patent
Estimating the term…
Abstract
An integrated circuit package system includes: providing a mountable structure having a contact pad and an inner pad; mounting an integrated circuit device having a linear through channel over the mountable structure with the linear through channel traversing between an integrated circuit device first side and an integrated circuit device second side; and connecting the linear through channel exposed on the integrated circuit device second side to the inner pad.
Claims10
An integrated circuit package system comprising:
- a mountable structure having a contact pad and an inner pad exposed through a protective layer of the mountable structure;
- and
- an integrated circuit device having a linear through channel over the mountable structure with the linear through channel traversing between an integrated circuit device first side and an integrated circuit device second side and with the linear through channel connected through the protective layer to the inner pad, the integrated circuit device first side and the integrated circuit device second side located along outermost boundaries of the integrated circuit device.
Dependencies are inferred from the claim text.