Package structures and methods for forming the same
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsChen-Hua Yu, Jiun Yi Wu, Tsung-Ding Wang
Life of this patent
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Abstract
A device includes a first package component and the second package component. The first package component includes a first plurality of connectors at a top surface of the first package component, and a second plurality of connectors at the top surface. The second package component is over and bonded to the first plurality of connectors, wherein the second plurality of connectors is not bonded to the second package component. A solder resist is on the top surface of the first package component. A trench is disposed in the solder resist, wherein a portion of the trench spaces the second plurality of connectors apart from the first plurality of connectors.
Claims13
A device comprising:
- a first package component comprising:
- a first plurality of connectors at a top surface of the first package component;
- and
- a second plurality of connectors at the top surface;
- a second package component over and bonded to the first plurality of connectors, wherein the second plurality of connectors is not bonded to the second package component;
- a solder resist on the top surface of the first package component, wherein the gap between the first package component and the second package component is substantially free from the solder resist;
- and
- a trench in the solder resist, wherein a portion of the trench spaces the second plurality of connectors apart from the first plurality of connectors.
A device comprising:
- a package substrate comprising:
- a first plurality of connectors at a top surface of the package substrate;
- and
- a second plurality of connectors at the top surface and encircling the first plurality of connectors;
- a top package component over and bonded to the first plurality of connectors;
- a solder resist on the top surface of the package substrate;
- and
- a trench in the solder resist, wherein the trench comprises a trench ring encircling the first plurality of connectors, and wherein the second plurality of connectors is outside of the region encircled by the trench ring.
Dependencies are inferred from the claim text.