Wiring boards and semiconductor packages including the same

A semiconductor package comprising:

• a wiring board;
• and
• a semiconductor chip mounted on the wiring board,
• wherein the wiring board comprises:
• a metal core comprising a first surface and a second surface opposite the first surface;
• a first buildup portion comprising a first insulating layer and a first pad pattern sequentially stacked, the first buildup portion being on the first surface;
• a second buildup portion comprising a second insulating layer and a second pad pattern sequentially stacked, the second buildup portion being on the second surface;
• a mask pattern comprising an opening exposing the second pad pattern, the mask pattern being on the second buildup portion;
• and
• a barrier pattern in an area in which a region of the metal core which overlaps with the second pad pattern is removed,
• wherein a minimum width of an outer circumference of the barrier pattern is greater than a maximum width of the second pad pattern, and
• wherein the semiconductor chip is mounted on the first buildup portion.

A wiring board comprising:

• a metal core;
• a buildup portion comprising a pad pattern, the buildup portion being on a surface of the metal core;
• a mask pattern comprising an opening exposing the pad pattern, the mask pattern being on the buildup portion;
• and
• a barrier pattern in an area in which a region of the metal core which overlaps with the pad pattern is removed,
• wherein a minimum width of an outer circumference of the barrier pattern is greater than a maximum width of the pad pattern.