Stacked microelectronic devices and methods for manufacturing stacked microelectronic devices
AssigneeMicron Technology, Inc.
InventorsEdmund Koon Tian Lua, See Hiong Leow, Choon Kuan Lee
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Abstract
Stacked microelectronic devices and methods of manufacturing stacked microelectronic devices are disclosed herein. In one embodiment, a method of manufacturing a microelectronic device includes forming a plurality of electrically isolated, multi-tiered metal spacers on a front side of a first microelectronic die, and attaching a back-side surface of a second microelectronic die to individual metal spacers. In another embodiment, the method of manufacturing the microelectronic device may further include forming top-tier spacer elements on front-side wire bonds of the first die.
Claims20
A microelectronic device, comprising:
- a first microelectronic die having a front side with bond sites;
- a second microelectronic die having a front side facing away from the first microelectronic die and a back side facing the first microelectronic die;
- a plurality of metal spacers interposed between the first and second dies, wherein each metal spacer includes at least two spacer elements, wherein the metal spacers are coupled with the front-side surface of the first die and the back-side surface of the second die, and wherein the metal spacers are electrically isolated from at least one of the first and second dies;
- and
- a stitched wire bond connected to one of the plurality of metal spacers.
A method of manufacturing a microelectronic device, the method comprising:
- forming a non-compressible metal spacer on a surface of a spacer site at a front side of a first microelectronic die, wherein the spacer has a plurality of stacked metal spacer elements, wherein the spacer is electrically connected to an integrated circuit of the first die;
- and
- attaching a second microelectronic die to the metal spacer, wherein the spacer is electrically isolated from an integrated circuit of the second die.
A method of manufacturing a microelectronic device, the method comprising:
- forming a plurality of multi-tiered metal spacers having first spacer elements on a front-side surface of a first microelectronic die and second spacer elements on corresponding first spacer elements;
- attaching a back-side surface of a second microelectronic die to the second spacer elements;
- and
- connecting a stitched wire bond to one of the plurality of multi-tiered metal spacers,
- wherein the first and second spacer elements are electrically isolated from the back-side surface of the second die.
Dependencies are inferred from the claim text.