Hybrid package construction with wire bond and through silicon vias

A packaged semiconductor system, comprising:

• a first tier die having a redistribution layer and a plurality of through substrate vias;
• a second tier die mounted on the first tier die, the second tier die being adjacent to the redistribution layer;
• a packaging substrate on which the first tier die is mounted;
• and
• a first plurality of wire bonds coupling the packaging substrate and the redistribution layer of the first tier die, a second plurality of wire bonds coupling the second tier die to the redistribution layer, the first and the second plurality of wire bonds providing power to the second tier die from the packaging substrate.

A method of providing power to a stacked IC semiconductor system having a first tier die with a redistribution layer, an active side including active circuitry and a plurality of through silicon vias extending entirely through the first tier die and coupled to the redistribution layer, the first tier die mounted on a packaging substrate, and the semiconductor system further including a second tier die mounted on the first tier die, the second tier die being adjacent to the redistribution layer, the method comprising:

• coupling at least one wire bond to the packaging substrate and the redistribution layer;
• coupling a plurality of wire bonds to the second tier die and the redistribution layer;
• providing a power supply to the second tier die through the at least one wire bond;
• and providing communication to the second tier die through at least one of the plurality of through silicon vias.

A semiconductor system, comprising:

• a first tier die having a means for redistributing power and an active side including active circuitry;
• a plurality of through substrate vias being coupled to the power redistributing means and extending entirely through the first tier die;
• a second tier die mounted on the first tier, the second tier die being adjacent to the power redistributing means;
• and
• a plurality of wire bonds coupling the second tier die and the power redistributing means.

A packaged semiconductor system, comprising:

• a first tier die having means for redistributing power and a plurality of through substrate vias;
• a second tier die mounted on the first tier die, the second tier die being adjacent to the power redistributing means;
• a packaging substrate on which the first tier die is mounted;
• and
• first plurality of wire bonds coupling the packaging substrate and the power redistributing means of the first tier die, a second plurality of wire bonds coupling the second tier die to the power redistributing means, the first and second plurality of wire bonds providing power to the second tier die from the packaging substrate.