Integrated circuit packaging system with protective coating and method of manufacture thereof

A method of manufacture of an integrated circuit packaging system comprising:

• forming a lead-frame having a die attach paddle and contact pads adjacent the die attach paddle, the die attach paddle and the contact pads connected by links;
• patterning a solder wettable area on a bottom of the lead-frame under the contact pads and the die attach paddle;
• mounting an integrated circuit die over the die attach paddle including applying an adhesive between the die attach paddle and the integrated circuit die;
• forming a protrusion at a peripheral edge of the die attach paddle and exposed edges about the contact pads by etching away the links between the contact pads and the die attach paddle, and forming a paddle recess in a bottom of the die attach paddle by partially etching a portion of the bottom of the die attach paddle spaced away from the peripheral edge of the die attach paddle;
• molding a package body on the lead-frame and the integrated circuit die, including portions of the die attach paddle and the contact pads, the package body having exposed bottoms between the die attach paddle and the contact pads leaving the protrusion and the exposed edges exposed from the package body, and portions of the die attach paddle and the contact pads exposed and extending below the package body;
• and
• depositing a solder-resistant layer on the protrusion, the exposed edges, and in the paddle recess, but not on bottoms of the lead-frame under the die attach paddle or the contact pads or the exposed bottom of the package body, the solder-resist layer consists of an oxide of metal.

An integrated circuit packaging system comprising:

• a die attach paddle having a paddle recess in a bottom of the die attach paddle spaced away from a peripheral edge of the die attach paddle;
• a protrusion at the peripheral edge of the die attach paddle;
• a contact pad adjacent to the die attach paddle, the contact pad having an exposed edge;
• an integrated circuit die mounted over the die attach paddle;
• a package body molded on the integrated circuit die including portions of the die attach paddle and the contact pad, the package body having an exposed bottom between the die attach paddle and the contact pad, wherein portions of the die attach paddle and the contact pad extend below and are exposed from the package body, and wherein the protrusion and the exposed edge are exposed from the package body;
• and
• a solder-resistant layer on the protrusion, the exposed edge, and in the paddle recess, but not on a bottom of the contact pad or the bottom of the die attach paddle or the exposed bottom of the package body, the solder-resistant layer consists of an oxide of metal.