Stacked integrated circuit package system
AssigneeSTATS ChipPAC, Ltd.
InventorYou Yang Ong
Life of this patent
Estimating the term…
Abstract
A stacked integrated circuit package system is provided forming a lead and a die paddle from a lead frame, forming a first integrated circuit die having an interconnect provided thereon, placing a second integrated circuit die over the first integrated circuit die and the die paddle, connecting the second integrated circuit die and the lead, and encapsulating the first integrated circuit die and the second integrated circuit die with a portion of the lead and the interconnect exposed.
Claims20
A method or manufacturing a stacked integrated circuit package system comprising:
- forming a lead and a die paddle from a lead frame;
- forming a first integrated circuit die having an interconnect provided thereon;
- placing a second integrated circuit die over the first integrated circuit die and the die paddle;
- connecting the second integrated circuit die and the lead;
- and
- molding an encapsulation on the first integrated circuit die and the second integrated circuit die with a portion of the lead and the interconnect exposed from a bottom of the encapsulation for further connection.
A method of manufacturing a stacked integrated circuit package system comprising:
- forming a lead and a die paddle from a lead frame;
- forming a first integrated circuit die having a first interconnect provided on an active side;
- placing a second integrated circuit die over the first integrated circuit die having the active side down and the die paddle;
- connecting a second interconnect between the second integrated circuit die and the lead;
- and
- molding an encansulation on the first integrated circuit die and the second integrated circuit die with a portion of the lead and the first interconnect exposed from a bottom of the encapsulation for further connection.
A stacked integrated circuit package system comprising:
- a lead;
- a die paddle adjacent to the lead;
- a first integrated circuit die having an interconnect provided thereon;
- a second integrated circuit die over the first integrated circuit die and the die paddle;
- the second integrated circuit die connected to the lead;
- and
- an encapsulation to cover the first integrated circuit die and the second integrated circuit die with a portion of the lead and the interconnect exposed from a bottom of the encapsulation.
Dependencies are inferred from the claim text.