Structure for picking up a collector and manufacturing method thereof
AssigneeShanghai Hua Hong NEC Electronics Co., Ltd.
InventorWensheng Qian
Life of this patent
Estimating the term…
Loading patent…
AssigneeShanghai Hua Hong NEC Electronics Co., Ltd.
InventorWensheng Qian
Estimating the term…
A structure for picking up a collector region is disclosed. The structure includes a pair of polysilicon stacks formed in the isolation regions and extending below the collector region; and a pair of collector electrodes contacting on the polysilicon stacks, wherein the pair of polysilicon stacks includes: a first polysilicon layer located below the isolation regions, and a second polysilicon layer located on and in contact with the first polysilicon layer, the first polysilicon layer being doped with a dopant having a higher diffusivity or higher concentration than a dopant of the second polysilicon layer, wherein a depth of the polysilicon stacks is greater than a depth of the collector region; the depth of the collector region is greater than a depth of the second polysilicon layer; and the depth of the second polysilicon layer is greater than a depth of the isolation regions.
A structure for picking up a collector region, the collector region being formed in a substrate and sandwiched between two isolation regions, the structure comprising:
Dependencies are inferred from the claim text.