Structures for grounding metal shields in backside illumination image sensor chips
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsZhe-Ju Liu, Chih-Cherng Jeng, Kuo-Cheng Lee, Szu-Hung Yang, Po-Zen Chen, Chi-Chin Hsu
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Abstract
A device includes a semiconductor substrate having a front side and a backside. A photo-sensitive device is disposed on the front side of the semiconductor substrate. A dielectric layer is disposed on the backside of the semiconductor substrate, wherein the dielectric layer is over a back surface of the semiconductor substrate. A metal shield is over the dielectric layer and overlapping the photo-sensitive device. A metal plug penetrates through the dielectric layer, wherein the metal plug electrically couples the metal shield to the semiconductor substrate.
Claims20
A device comprising:
- a semiconductor substrate having a front side and a backside;
- a photo-sensitive device disposed on the front side of the semiconductor substrate;
- a dielectric layer on the backside of the semiconductor substrate, wherein the dielectric layer is over a back surface of the semiconductor substrate;
- a metal shield over the dielectric layer and overlapping the photo-sensitive device;
- and
- a metal plug penetrating through the dielectric layer, wherein the metal plug electrically couples the metal shield to the semiconductor substrate.
A device comprising:
- a semiconductor substrate having a front side and a backside;
- a first photo-sensitive device, a second photo-sensitive device, and a logic device disposed on the front side of the semiconductor substrate;
- a dielectric layer on the backside of the semiconductor substrate, wherein the dielectric layer is over a back surface of the semiconductor substrate, and extends over the first and the second photo-sensitive devices and the logic device;
- a metal shield over the dielectric layer and overlapping the first photo-sensitive device and the logic device;
- and
- a metal plug penetrating through the dielectric layer, wherein the metal plug is in contact with the metal shield and the semiconductor substrate.
A device comprising:
- a semiconductor substrate having a front side and a backside;
- a photo-sensitive device and a logic device disposed at the front side of the semiconductor substrate;
- a dielectric layer on the backside of the semiconductor substrate, wherein the dielectric layer is overlying a back surface of the semiconductor substrate;
- and
- a metal feature comprising:
- a metal shield over the dielectric layer and overlapping the photo-sensitive device;
- and
- a metal plug extends from the metal shield down into the dielectric layer, wherein a bottom surface of the metal plug is in contact with the semiconductor substrate, wherein the metal plug and the metal shield form a continuous region, and wherein the metal plug and the metal shield are formed of a same material.
Dependencies are inferred from the claim text.