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US 8,803,239 B2Granted
High temperature operating package and circuit design
AssigneeFairchild Semiconductor Corporation
InventorsNeill Thornton, Dennis Lang
Life of this patent
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Abstract
The invention provides a semiconductor device that is thermally isolated from the printed circuit board such that the device operates at a higher temperature and radiates heat away from the printed circuit board. In another embodiment, the semiconductor is stacked onto a second device and optionally thermally isolated from the second device.
Claims6
A circuit comprising:
- a high temperature power device having a first source region, a first gate region and a first drain region;
- a series power device having a second source region, a second gate region and a second drain region, the second source region facing the first drain region;
- and
- a thermal resistance layer between the high temperature power device and the series power device, the thermal resistance layer providing an electrical connection between the first drain and the second source.
1 more element
Dependencies are inferred from the claim text.