Solid state lighting component package with reflective layer
AssigneeCree, Inc.
InventorPeter Andrews
Life of this patent
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Abstract
A solid state lighting package is provided. The package comprising at least one LED element positioned on a top surface of a substrate or a submount capable of absorbing light emitted by the at least one LED element; and a reflective layer, the reflective layer covering at least a portion of the top surface of the substrate or the submount, whereby at least of portion of the light emitted by the LED element is reflected by the reflective layer. A method of manufacturing a solid state lighting package comprising the reflective layer, and a method of increasing the luminous flux thereof, is also provided.
Claims89
A solid state lighting package comprising:
- at least one die pad mounted LED element positioned on a top surface of a substrate or a submount capable of absorbing light emitted by the at least one LED element, the at least one LED element having a light emitting edge height from the substrate or submount;
- and
- a reflective layer comprising a transparent matrix comprising a highly reflective material, the transparent matrix being substantially transparent to wavelengths of light emitted by the at least one LED element;
- the reflective layer in proximity to the at least one LED element and covering at least a portion of the top surface of the substrate or the submount, wherein the reflective layer height from the substrate or submount is less than the light emitting edge height of the at least one die pad attached LED element and substantially avoids covering any part of the LED element capable of emitting light, whereby at least of portion of the light emitted by the LED element is reflected by the reflective layer.
A method of manufacturing a solid state lighting package comprising:
- providing an array of LED elements forming at least one channel between the LED elements of the array mounted on a substrate or submount;
- introducing a transparent matrix comprising a highly reflective material to the at least one LED element and the substrate or submount, wherein the highly reflective material is introduced having a viscosity capable of being drawn by capillary action into the at least one channel;
- urging the transparent matrix comprising the highly reflective material into the at least one channel via capillary action;
- controlling the reflective layer height from the substrate to less than the height of a light emitting surface of the at least one die pad attached LED element from the substrate or submount;
- forming a reflective layer in proximity to the at least one LED element and covering at least a portion of the substrate or submount;
- and
- avoiding covering any part of the LED element capable of emitting light with the reflective layer.
A method of increasing the luminous flux of a solid state lighting package, the method comprising:
- providing a solid state lighting package having at least one die pad mounted LED element on a substrate or submount capable of absorbing light emitted by the at least one LED element;
- providing a reflective layer comprising a transparent matrix comprising a highly reflective material, the reflective layer in proximity to the at least one LED element and covering at least a portion of the substrate or submount, the reflective layer height from the substrate or submount being less than or flush with a bottom edge height of the at least one LED element from the substrate or submount, so that the reflective layer is substantially prevented from covering any light emitting surface of the LED element;
- and
- reflecting light emitted by the at least one LED element by the reflective layer, thereby increasing the luminous flux of the solid state lighting package.
A solid state lighting package comprising:
- at least one LED element positioned on a top surface of a substrate or a submount capable of absorbing light emitted by the at least one LED element;
- and
- a reflective layer comprising a transparent matrix comprising a cellular structure capable of reflecting the light emitted by the LED element, the reflective layer in proximity to the at least one LED element and covering at least a portion of the top surface of the substrate or the submount, whereby at least of portion of the light emitted by the LED element is reflected by the reflective layer.
A method of manufacturing a solid state lighting package comprising:
- providing at least one LED element mounted on a substrate or submount;
- introducing a transparent matrix comprising a foaming agent to the at least one LED element and the substrate or submount;
- and
- forming a reflective layer comprising a cellular structure in proximity to the at least one LED element and covering at least a portion of the substrate or submount.
A method of increasing the luminous flux of a solid state lighting package, the method comprising:
- providing a solid state lighting package having at least one LED element mounted on a substrate or submount capable of absorbing light emitted by the at least one LED element;
- providing a reflective layer in proximity to the at least one LED element and covering at least a portion of the substrate or submount, wherein the reflective layer comprises a transparent matrix comprising a cellular structure;
- and
- reflecting light emitted by the at least one LED element by the reflective layer, thereby increasing the luminous flux of the solid state lighting package.
A method of manufacturing a solid state lighting package comprising:
- providing at least one LED element mounted on a substrate or submount;
- introducing a transparent matrix to the at least one LED element and the substrate or submount;
- depositing a highly reflective material on the transparent matrix;
- and
- forming a reflective layer in proximity to the at least one LED element and covering at least a portion of the substrate or submount.
Dependencies are inferred from the claim text.