Light emitting diode package and method of fabricating the same
AssigneePeiching Ling
InventorsPeiching Ling, Vivek B. Dutta
Life of this patent
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Abstract
A light emitting diode package and a method of fabricating the same. The package includes a light emitting diode chip having a first surface and a second surface opposing the first surface, a metal frame (or TAB tape) having leads connected to the light emitting diode chip, and a light-pervious encapsulant encapsulating the light emitting diode chip, wherein the second surface of the chip is exposed from the first light-pervious encapsulant. The metal frame (or TAB tape) connects the light emitting diode chip to an external circuit board. The LED package does not need wire-bonding process. A method of fabricating a light emitting diode package is also provided.
Claims13
A light emitting diode package, comprising:
- a light emitting diode chip having a first surface and a second surface opposing the first surface;
- at least a first electrode pad formed on the first surface of the light emitting diode chip;
- a metal frame having at least a first lead electrically connected to the at least a first electrode pad;
- and
- a support layer having a plurality of opening areas, and wherein the at least a first lead each has a first end connected to the at least a first electrode pad and a second end opposing the first end, and both of the first end and the second end are exposed from a corresponding one of the opening areas of the support layer and free from being in contact with the support layer.
A method of fabricating a light emitting diode package, comprising:
- providing a light emitting diode chip having a first surface and a second surface opposing the first surface, and at least a first electrode pad formed on the first surface;
- and
- connecting at least a first lead of a metal frame to the at least a first electrode pad, wherein the metal frame is made by:
- forming on a surface of a substrate at least a leaf of metal layer having a first end and a second end opposing the first end;
- forming a conductive element on the first end of the metal layer, such that the metal layer and the conductive element are formed into the first lead;
- and
- removing the substrate after the first lead is connected to the at least a first electrode pad.
A method of fabricating a light emitting diode package, comprising:
- providing a light emitting diode chip having a first surface and a second surface opposing the first surface, and at least a first electrode pad formed on the first surface;
- and
- connecting at least a first lead of a metal frame to the at least a first electrode pad, wherein the metal frame is made by:
- forming on a mold at least a leaf of metal layer having a first end and a second end opposing the first end, the first end and the second end having a height difference;
- forming a conductive element on the first end of the metal layer, such that the metal layer and the conductive element are formed into the first lead;
- connecting the conductive element of the first lead to the at least a first electrode pad;
- and
- removing the mold.
A method of fabricating a light emitting diode package, comprising:
- providing a light emitting diode chip having a first surface and a second surface opposing the first surface, and at least a first electrode pad formed on the first surface;
- and
- connecting at least a first lead of a metal frame to the at least a first electrode pad, wherein the metal frame is formed on a support layer having a plurality of opening areas, and the at least a first lead each has a first end connected to the at least a first electrode pad and a second end opposing the first end, and both of the first end and the second end are exposed from a corresponding one of the opening areas of the support layer and free from being in contact with the support layer.
Dependencies are inferred from the claim text.